Huawei ships over 100 million Kirin-powered devices since 2023

Huawei’s next-generation Kirin chip, planned for 2027, is undergoing testing with initial results meeting expectations. According to DigiTimes, the company has also begun mass-producing its Kirin 9050 series using LogicFolding, a 3D architecture designed to improve transistor density and computing efficiency without depending solely on smaller manufacturing process nodes.

• Huawei returned to premium smartphones in 2023, according to the South China Morning Post.

Covered by 2 publishers within 18 hours of the first report.

• DigiTimes: Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?

Reporting2

WCF Wccftech Huawei’s LogicFolding Architecture Has Surpassed Expectations, As Early 2027 Kirin Results Meet Company’s Targets Without Reliance On Advanced Nodes · Omar Sohail 8:15 AM

DT DigiTimes Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints? · Levi Li 2:03 AM

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Topics Huawei