Applied Materials and Intel expand chipmaking development partnership

The companies are working on next-generation transistors, interconnects and advanced packaging as AI increases manufacturing demands. The collaboration will combine capabilities from Applied Materials’ EPIC Center in Silicon Valley and Intel’s research campus in Hillsboro, Oregon, aiming to shorten the time needed to bring technologies to market, according to HPCwire.

Covered by 2 publishers within 28 hours of the first report.

• DigiTimes: Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D

Reporting2

HPC HPCwire Applied Materials and Intel Collaborate on Chipmaking Innovations for AI-Driven Computing · Andrew Jolly 5:22 PM

DT DigiTimes Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D · Levi Li 9:42 PM

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Topics Intel