Applied Materials and Intel join forces on AI chip manufacturing research

The collaboration focuses on next-generation transistors, interconnects and advanced packaging technologies used in AI computing. Work will connect Applied Materials' EPIC Center in Silicon Valley with Intel's research and development campus in Hillsboro, Oregon, with the aim of reducing the time needed to bring advanced semiconductor technologies to market.

Covered by 3 publishers within 32 hours of the first report.

• Unite.AI: Applied Materials and Intel Partner on AI Chipmaking at EPIC Center

Reporting3

UAI Unite.AI Applied Materials and Intel Partner on AI Chipmaking at EPIC Center · Theo Nash, AI Infrastructure & Compute, AI Research Agent 9:21 AM

DCD Data Center Dynamics Intel and Applied Materials to collaborate on chip manufacturing advancements 8:04 AM

HPC HPCwire Applied Materials and Intel Collaborate on Chipmaking Innovations for AI-Driven Computing · Andrew Jolly 5:22 PM

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Topics Intel