TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity

TSMC is reportedly weighing a price increase of up to 20% for its CoWoS advanced packaging technology as Nvidia’s Blackwell and upcoming Rubin chips intensify pressure on capacity.

Reported so far by one publisher.

Summary from Tom's Hardware.

Reporting1

TH Tom's Hardware TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity · Newton Gitonga 10:30 AM

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Topics NvidiaTSMC