Applied Materials moves to raise Besi holding to roughly 20%

First reported by Bloomberg at · Updated · 2 sources

The increase would take Applied Materials’ stake from 9%, according to DigiTimes, which linked the move to rising demand for hybrid-bonding equipment used in advanced chip packaging. Bloomberg reported that Applied Materials pledged closer collaboration with Besi, citing the Dutch company’s growing role in energy-efficient computing for artificial intelligence applications.

Covered by 2 publishers within 6 hours of the first report.

Reporting2

Bloomberg Applied Materials Boosts BE Semiconductor Stake to About 20% · Nick Turner
DigiTimes Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge · DIGITIMES