Pat Gelsinger criticizes HBM as AI exposes hardware bottlenecks
AI is simplifying chip design while manufacturing, memory and energy constraints drive renewed hardware development, Pat Gelsinger said, according to DigiTimes. Wccftech reports that the former Intel CEO criticized HBM's density, thermal performance and bandwidth limitations while acknowledging it remains the best available option. DigiTimes says his discussion also covered optical interconnects.
- Nanya expects DRAM shortages to persist until early 2028, according to Wccftech.
Covered by 2 publishers within 9 hours of the first report.
- DigiTimes: Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
Reporting2
Wccftech Intel’s Ex-CEO Pat Gelsinger Says HBM Is A “Hideous Memory,” Replete With Terrible Bit Density, And Thermal And Shoreline Bandwidth Issues, Even As Nanya Reiterates DRAM Shortages Till 2028 · Rohail Saleem
DigiTimes Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects · Charlene Chen
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Topics Intel