GlobalFoundries signs $2 billion deal to supply TSMC with US interposers

The five-year agreement will supply silicon interposers for TSMC’s CoWoS advanced packaging ecosystem, supporting AI and high-performance computing demand. GlobalFoundries will manufacture the components at its Malta, New York, fab, which will become the first US source, according to Data Center Dynamics. Production is expected to ramp in early 2028, according to RuntimeWire.

• GlobalFoundries shares rose as much as 7%, according to Bloomberg.

Covered by 5 publishers within 5 hours of the first report.

• Tom's Hardware: GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

Reporting5

HPC HPCwire GlobalFoundries and TSMC Sign US Manufacturing Deal for AI Packaging · Andrew Jolly 10:49 AM

DCD Data Center Dynamics GlobalFoundries signs $2bn, five-year deal with TSMC for production of advanced packaging components 11:07 AM

BL Bloomberg GlobalFoundries Rallies After Announcing $2 Billion TSMC Deal · Ian King 11:26 AM

TH Tom's Hardware GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion · Anton Shilov 2:23 PM

RTW RuntimeWire GlobalFoundries will make TSMC's AI interposers under a $2B deal · Ryan Merket 3:35 PM

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Topics TSMCData centers